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PC Edge AI PN-Palladio-500-RPL-AI
AIdi inferenza di IAGPU

PC Edge AI - PN-Palladio-500-RPL-AI - SECO - AI / di inferenza di IA / GPU
PC Edge AI - PN-Palladio-500-RPL-AI - SECO - AI / di inferenza di IA / GPU
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Caratteristiche

Tipo
Edge AI, GPU, AI, di inferenza di IA
Configurazione
embedded
Processore
Intel® Core i5, Intel® Core i7, Intel® Core i3, Intel® Core™ i9-13900
Porte
DisplayPort, RS-232, RS-485, RJ45, WiFi, 2,5 GbE, RS-422, USB 3.2, Bluetooth, SATA III
Sistema operativo
Linux, Windows
Altre caratteristiche
PoE, con modulo di accelerazione AI
Memoria
32 GB

Descrizione

Overview
The Palladio 500 RPL AI is a modular embedded industrial workstation for edge AI and advanced graphics applications, powered by 13th Gen Intel® Core™ (Raptor Lake-P) processors and Intel® Arc™ Pro B50 Graphics. It supports up to 32 GB SO-DIMM DDR4 2666 memory and Intel® Arc™ Pro B50 with 16 GB DDR6 VRAM for high-performance AI and graphics workloads.

Highlights
  • CPU: 13th Gen Intel® Core™ i3/i5/i7/i9 processors
  • AI Accelerator: Intel® Arc™ Pro B50 powered AI acceleration (up to 170 INT8 TOPS)
  • Memory: Up to 32 GB SO-DIMM DDR4 2666
  • Connectivity: 2x 2.5 GbE LAN (2x PoE optional); optional Wi‑Fi/BT

Dettagli tecnici (tabella)
Descrizione: The Palladio 500 RPL AI is a high-performance industrial workstation for edge AI and advanced graphics applications, powered by 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics.

CPU Description: 13th Gen Intel® Core™ Processors (codename: Raptor Lake-P):
  • Intel® Core™ i3-13100E — 3.3–4.4 GHz, 4 cores, 8 threads — 60 W TDP
  • Intel® Core™ i3-13100TE — 2.1–4.1 GHz, 4 cores, 8 threads — 35 W TDP
  • Intel® Core™ i5-13500E — 2.4–4.6 GHz, 14 cores, 20 threads — 65 W TDP
  • Intel® Core™ i5-13500TE — 1.3–4.5 GHz, 14 cores, 20 threads — 35 W TDP
  • Intel® Core™ i7-13700E — 1.9–5.1 GHz, 16 cores, 24 threads — 65 W TDP
  • Intel® Core™ i7-13700TE — 1.1–4.8 GHz, 16 cores, 24 threads — 35 W TDP
  • Intel® Core™ i9-13900E — 1.8–5.2 GHz, 24 cores, 32 threads — 65 W TDP
  • Intel® Core™ i9-13900TE — 1.0–5.0 GHz, 24 cores, 32 threads — 35 W TDP

Memory Description: Up to 32 GB SO-DIMM DDR4 2666 (optional).

Graphics Description: Intel® Arc™ Pro B50 Graphics powered graphics with 16 GB DDR6 VRAM. Support for up to four independent displays at up to 8K60 resolution.

Video Interfaces Description: 2x DisplayPort.

Video Resolution Description: Up to 4K @ 60 Hz.

Mass Storage Description: 1x M.2 2280 (SATA); 1x M.2 2280 (PCIe Gen4 x4; SATA); 1x M.2 2280 (PCIe Gen4 x4) ; 2x SATA 2.5" drives (optional hot-swap).

Networking Description: Intel® embedded M.2 2230 802.11ac Wi‑Fi + BT 5.1 card with cables (optional); dual-band terminal PIFA antenna (optional); 2x 2.5 GbE LAN (2x PoE optional).

USB Description: 6x USB 3.2 Gen 2 ports.

PCI Description: 1x mPCIe (PCIe x1; USB 2.0); 1x M.2 2230 E-key (PCIe x1; USB 2.0); 1x M.2 2280 M-key (PCIe Gen4 x4); 1x M.2 2280 M-key (PCIe Gen4 x4; SATA); 1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA); 1x PCIe Gen4 x16 or 2x PCIe Gen4 x8 (factory option).

Audio Description: 1x 3.5 mm audio.

Serial Ports: 2x COM RS-232/422/485 ports.

Other Interfaces: 5-pin terminal block power input (12–48 VDC); 2x ModBay expansion 7–9.5 mm (optional); 1x GPIO terminal block (DIO, CAN, Ext. Switch); 2x 3FF Micro-SIM; 1x power button; 1x external fan connector; support for 2x 2.5" hot-swap drives (optional).

Sicurezza: PTT in BIOS; TPM (optional); Watchdog timer.

Power Supply: 12–48 VDC (20–48 VDC when configured with PCIe expansion 70W or above).

Operating System: Compatible with Linux, Windows.

Operating Temperature: -40 to 70°C (with 35W CPU); -40 to 50°C (with 65W CPU).

Dimensions: 240 x 143 x 267 mm

Cataloghi

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* I prezzi non includono tasse, spese di consegna, dazi doganali, né eventuali costi d'installazione o di attivazione. I prezzi vengono proposti a titolo indicativo e possono subire modifiche in base al Paese, al prezzo stesso delle materie prime e al tasso di cambio.