Sistema di visione per ispezione 100-SO-10-MAN-001 / AN_SO_EC_2604
di rilevazionedi controllo qualitàdi visione per macchina industriale

Sistema di visione per ispezione - 100-SO-10-MAN-001 / AN_SO_EC_2604 - OPTO - di rilevazione / di controllo qualità / di visione per macchina industriale
Sistema di visione per ispezione - 100-SO-10-MAN-001 / AN_SO_EC_2604 - OPTO - di rilevazione / di controllo qualità / di visione per macchina industriale
Sistema di visione per ispezione - 100-SO-10-MAN-001 / AN_SO_EC_2604 - OPTO - di rilevazione / di controllo qualità / di visione per macchina industriale - immagine - 2
Sistema di visione per ispezione - 100-SO-10-MAN-001 / AN_SO_EC_2604 - OPTO - di rilevazione / di controllo qualità / di visione per macchina industriale - immagine - 3
Sistema di visione per ispezione - 100-SO-10-MAN-001 / AN_SO_EC_2604 - OPTO - di rilevazione / di controllo qualità / di visione per macchina industriale - immagine - 4
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Caratteristiche

Funzione
di rilevazione, per ispezione, di controllo qualità, di visione per macchina industriale
Applicazioni
per macchine, di automatizzazione
Settore
industriale
Specificazioni
con telecamera per compiti di ispezione, con telecamera, per visione artificiale, in linea

Descrizione

100-SO-10-MAN-001 / AN_SO_EC_2604 Electronic Components Anomaly Opto solino RTI sensor

Overview
The Opto RTI Vision Sensor solino® is a complete computational imaging vision sensor that uses Opto's proprietary solino® technology to render object anomalies as images for further digital or statistical processing. It can be used to inspect Semicon packages and electronic components before assembly.

While Standard camera systems, which rely on fixed lighting conditions, often struggle with reflective metallic surfaces such as solder balls and Glare and reflections can hide defects or produce unreliable inspection results, the solino RTI sensor combines controlled illumination with computational imaging to reveal surface structures that are difficult to detect using traditional machine vision systems.

Because solino® captures the surface under 64 illumination directions, even small surface irregularities become visible with significantly enhanced contrast.

This enables reliable inspection of semiconductor packages, BGA solder arrays and electronic components, helping manufacturers improve quality assurance and reduce the risk of defects during electronic assembly.

The inspection system consists of:
• solino RTI sensor
• integrated dome illumination with 64 LEDs
• high-resolution 20 MP industrial camera
solinoStudio software for image acquisition and processing

The sensor design allows integration into inspection stations or automated production systems.

Inspection workflow:
1. Electronic component is positioned under solino sensor
2. The system captures a series of images under varying illumination directions
3. Computational algorithms reconstruct the surface reflectance information
4. solinoStudio enables visualization of surface structures


solino® BRDF sensor for anomaly detection:
solino® is based on Bidirectional Reflection Distribution Function (BRDF) measurement – the physics behind visual appearance.

It uses 64 LEDs in a precisely calibrated dome to illuminate the surface from all directions. The reflected light is analysed to derive:

  • colour, waviness and roughness
  • reflectivity and inclination
  • surface stress and microstructure anomalies

solino® digitizes the visual appearance of objects and enables fully reproducible imaging of the smallest defects on scattering surfaces.
  • powerful plug & play imaging module
  • includes software for photometric stereo image acquisition
  • integrated 64 LED mesh dome illumination
  • redefinition of surface texture standards
  • robust design for easy automation

Applications:
Modern electronic assemblies rely on highly precise semiconductor packages and solder connections. Components such as BGA packages, processors and high-density electronic modules must meet extremely strict quality standards to ensure reliable electrical performance and long-term durability.

Manufacturers require reliable inspection methods for:
• solder ball arrays on BGA packages
• semiconductor chip packages
• contact pads and electrical interfaces
• microelectronic surface structures
• contamination or foreign particles on packages

The goal is to detect surface defects early in the production process and ensure consistent quality across all electronic components before assembly.


Advantages:
captures all surface features and anomalies
detection of roughness, reflectivity and tilt
eliminates reflections on metallic surfaces
detection of impurities on PCB surfaces


Specifications:
Magnification: 1x
FoV [mm]: 12,3 x 12,3
Working distance [mm]: 5
Camera: 20 MP, USB 3.2 Gen1
Object Space Resolution [μm/Px]: 2,7
DoF [mm]: 0,35
Image: Colour
Illumination: 64LED-Dome incl. controller
Dimensions [mm] (WxLxH) : 206 x 20x x 280.9
CE / RoHS / WEEE-Reg.-No. DE 68564667
Software: solinoStudio software and SDK included
solino Stand
solino Power Supply Package EU
USB cable, USB-C straight to USB-A, screwable, 1m

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